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Products

All of our products are electrically configurable with GLink™, our patented, highly reliable, non-destructive poly fuse technology. Our products are also lower cost, smaller size and lower power than similar semiconductors. 

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With our GM10 product, a timing company is able to replace most of their crystal oscillator (XO) and voltage-controlled oscillator (VCXO) product lines with a single customizable die + resonator.  The GM10 enables the VCXO, and the XO for CMOS and differential markets. With our 2nd product (GM35) a manufacturer's product line is complete with highly competitive low power/high volume programmable CMOS SPXO’s. The GM35 enables the CMOS SPXO markets + programmable fundamental mode. Our future fundamental products enable the highest performance communications markets.​

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Products are available as individual die (Die products), or packaged together with an oscillator for a complete PLL (Packaged PLL products). ​​

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Die Products​

GM10 Die

  • XO or VCXO operation

  • 10-1500 MHz, <1 Hz resolution

  • CMOS, LVPECL or LVDS outputs

  • 3.3 or 2.5 V (Industry’s lowest power) – 17 mA

  • Up to 4 Frequencies (selectable)

  • .76 mm^2 (Industry’s smallest silicon area)

  • Jitter (10-1500 MHz) – Performance meets 90% of 1B unit requirements

  • Phase Jitter (12 KHz to 20 MHz)

  • <1 ps fractional mode

  • <.5 ps integer mode

  • <100 fs phase jitter (1.875 to 20 MHz)​

GM35 Die

  • 4-pin SPXO, Standard Packaging (5070-2016)

  • 2 Modes

    • Xtal Oscillator 1-80 MHz; 1,2,4,8,16 divider

    • PLL 1-170 MHz

  • CMOS output, 16 output drive levels (tailored rise and fall times vs. voltage and frequency)

  • Xtal Trimming, +/- 100 ppm, 1.5 ppm steps (Integer)

  • PLL Trimming, <1 PPM (Fractional)

  • 1.8 -3.3 V (Industry’s lowest power) – 6 mA

  • 0.5 mm^2 (same as fundamental oscillator)

  • Packages – 5070, 5032, 3225, 2520, 2016

  • Future-proof - 1612, 1210 & 1008​​

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Packaged PLL Products

GM10

  • Packages

    • 6-Pin 7050-2520 Modules with Xtals

    • 3x3 mm QFN (no Xtal) 

  • XO or VCXO operation

  • 10-1500 MHz, <1 Hz resolution

  • CMOS, LVPECL or LVDS

  • 3.3 or 2.5 V (Industry’s lowest power) – 17 mA

  • Up to 4 Frequencies (selectable)

  • .76 mm^2 (Industry’s smallest silicon area)

  • Jitter (10-1500 MHz) – Performance meets 90% of 1B unit requirements

  • Phase Jitter (12 KHz to 20 MHz)

  • <1 ps fractional mode

  • <.5 ps integer mode

  • <100 fs phase jitter (1.875 to 20 MHz)

GM35

  • Packages

    • 4-pin SPXO, 7050-2016 Modules with Xtals

    • 2x2 mm DFN (no Xtal)

  • 2 Modes

    • Xtal Oscillator 1-80 MHz; 1,2,4,8,16 divider

    • PLL 1-170 MHz

  • CMOS output, 16 output drive levels (tailored rise and fall times vs. voltage and frequency)

  • Xtal Trimming, +/- 100 ppm, 1.5 ppm steps (Integer)

  • PLL Trimming, <1 PPM (Fractional)

  • 1.8 -3.3 V (Industry’s lowest power) – 6 mA

  • 0.5 mm^2 (same as fundamental oscillator)

  • Packages – 5070, 5032, 3225, 2520, 2016

  • Future-proof - 1612, 1210 & 1008​

Future Products

High Frequency Fundamental Oscillator

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  • 30-1000 MHz

  • XO or VCXO

  • Trimming and Pulling Options

  • <20 fS Phase Jitter

  • Output Dividers

  • /1, 2, 4, 8, 16

  • LVDS or LVPECL

  • Low Current

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Everything is electrically configurable (GLink™). GLink is our patented highly reliable non-destructive poly fuse technology.

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